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Connector for CMOS Camera Module
SCKA Series
Compact size achieved from thin body-forming molding.
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM
Features
Camera module detaching function. Locking mechanism to prevent the camera module from falling. Shield cover included. Vibration resistant contact structure. Provided with an adsorption area allowing automatic mounting.
Applications
For camera-equipped mobile phones
For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM
Typical Specifications
Items Dimensions Structure 6 6mm module type Mounting system Operating temperature range Voltage proof Performance Insulation resistance Initial Specifications
7 7 3.1mm Surface mounting type -25 to 85
For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
100V AC 1minute 1,000M 100m min. max.
Contact resistance Initial Insertion and removal cycles
10cycles
Product Line
Items Product
Connector 6 6mm module type Cover 5,000 JSCKA0002A 2
Minimum packing unit pcs.
2,000
Packing system
Taping
Product No.
SCKA2A0100
Drawing No.
1
61
Connector for CMOS Camera Module SCKA Series
Dimensions
6G6mm module type
No. For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM 1 Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
0.45 2.6 0.325 0.65 0.42 2.35 6.15 6.98
Unit:mm
Style
Connector
1.75 1.85 0.8
1.8
6.98 6.15
3.1
0.325 Pitch 0.65 2.6
0.2
PC board mounting hole dimensions Viewed from the mounting face side
6.8 1.4
6.7
0.7
Style Cover
7.4
Connector/Cover combination diagram Reference
1.15
7.4
7.4
2
7.4
CMOS camera module
3.45
62
(3.85)
Connector for CMOS Camera Module
Soldering Conditions
Example of Reflow Soldering Condition Reference
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T at soldering portion. 3. Temperature profile
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM
250 (max.) Temperature (C ) 220 200 190%10
100 Time (s) Pre-heating 90 30 sec. 55 sec.(max.)
Room temperature
For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus
Heating time
sec.
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. When soldering, do not use water soluble flux because this may corrode the product. 3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions. 4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and layout.
For Express CardTM For CMOS Camera Module
63

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